Shanghai makes China’s first domestic 7nm scanner by 2038
The Race for Light: China’s Ambition to Master Immersion Lithography
In the high-stakes world of semiconductor manufacturing, where the speed of light dictates the pace of innovation, a determined race is underway in China to achieve self-sufficiency in advanced lithography technology. The latest developments point toward a significant state-backed push into immersion deep ultraviolet lithography (DUV), aiming to secure a crucial piece of the global chipmaking puzzle.
Shanghai Aishengna Electronic Technology Group has recently been named the state-owned entity responsible for producing China’s first domestic DUV scanners. This move follows earlier news regarding the program’s initiation, signaling a major commitment to developing indigenous capabilities in this highly specialized field. Established with substantial registered capital and bolstered by engineering talent from leading local technology firms, Aishengna represents a significant investment in foundational semiconductor equipment.
The ambition extends beyond just the scanner itself. True immersion lithography requires a complex ecosystem of components—from the photoresist materials and coater tracks to the light sources. The integration of these elements is where the real technological challenge lies, demanding precise mechanical and thermal matching between the exposure machine and its supporting systems.
Globally, established giants like Tokyo Electron dominate the coater/developer market, reflecting the complexity of this equipment. While companies are working on achieving similar capabilities, the specialized materials themselves remain highly segmented. For instance, control over ArF photoresist materials is shared among major players, with Chinese suppliers currently holding a minimal footprint in high-end immersion resist.
Further compounding the technological landscape are the critical components necessary to complete the process. The excimer laser market is dominated by a few key entities, and while China has made strides in developing domestic lasers, the technology remains several generations behind what modern 28nm immersion requires. This gap highlights that mastering the lithography system means mastering the entire chain: the machine, the tracks, the resist, and the light source.
The demands on these technologies are intensifying as chip manufacturers push for higher density. For example, scaling DRAM requires advanced multipatterning techniques, and gaining an indigenous immersion source is seen as vital to keep pace with market demand and competitive pressures.
Adding a layer of complexity is the geopolitical backdrop. Measures like the MATCH Act introduce significant restrictions on the export and servicing of DUV systems to China, placing new constraints on technology transfer and supply chain management. This situation forces domestic providers to navigate both technological development and complex international trade regulations simultaneously.
Despite these hurdles, the trajectory remains focused on catching up. While projections suggest a commercially viable domestic 7nm-capable immersion scanner is still likely a decade away—perhaps between 2032 and 2038—the commitment to building this domestic capability demonstrates an unwavering drive. The quest for self-sufficiency in advanced chipmaking tools is a high-stakes gamble, but the race toward mastering light and material science is firmly underway.
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